HIGH PERFORMANCE RELEASE AND PARTING FILM
A new generation of films combining the chemical inertness and universal non-stick properties of PTFE polymers with maximum conformability and heat resistance.
Compare the data shown for D7000 versus other materials typically used in composite fabrication in order to understand the superior performance particularly for complex shapes and high temperature resins.
| Film Product | Elongation (%) |
Max. Temp. (F) |
| D7000 | 450 | 600 |
| Teflon FEP | 300 | 500 |
| Teflon PFA | 430 | 550 |
| Tedlar PVF | 190 | 350 |
| Halar ECTFE | 200 | 350 |
D7000 exhibits superior release qualities over the entire temperature range. It has been successfully used in intermittent service temperature above 600°F. The high elongation allows for superior conformability for irregular shapes.
Consider D7000 for the most advanced thermosetting and thermoplastic resin systems in the curing temperature range of epoxy, phenolic, BMI and comparable resins (350°F-400°F) as well as higher temperatures (600°F) where D7000, in fact, proves to be the only conformable yet thermally stable film available.
STANDARD PERFORATION PATTERNS |
||
| P | -— |
.045" diameter on 1/4" staggered centers. Used as porous materials for high resin flow |
| P3 | -— |
.015" diameter on 1/4" staggered centers |
| P4 | -— |
.045" diameter on 2" centers |
P5 |
-— |
.045" diameter on 3-1/2" centers |
P7 |
-— |
.015" diameter on 3" centers; S designed for P1 and Phenolic |
| P8 | -— |
.015" diameter on 8" centers; S for net resin prepregs |
NOTE: THE INFORMATION CONTAINED HEREIN IS BELIEVED BY DE-COMP COMPOSITES, INC. TO BE ACCURATE. HOWEVER, NO WARRANTY EXPRESSED OR IMPLIED IS MADE REGARDING THIS DATA , THIS MATERIAL, OR RESULTS THERE FROM WHETHER USED IN ACCORDANCE WITH OUR INSTRUCTIONS OR NOT. THE USER SHALL MAKE HIS/HER OWN TESTS TO DETERMINE SUITABILITY OF THIS MATERIAL FOR HIS/HER PARTICULAR PURPOSES, IN ANY EVENT, DE-COMP’S LIABILITY SHALL BE LIMITED TO THE PURCHASE PRICE OF THE MATERIAL.
| Home Page | Product List | Top of Page | E-mail De-Comp |
